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      Electrically Conductive Adhesives

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      SKU 9789004165922 Categories ,

      Environmentally-friendly ECAs offer many advantages vis-a-vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch. This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8...

      £240.00

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      Description

      Product ID:9789004165922
      Product Form:Hardback
      Country of Manufacture:GB
      Title:Electrically Conductive Adhesives
      Authors:Author: Kash L. Mittal, Rajesh Gomatam
      Page Count:426
      Subjects:Physical chemistry, Physical chemistry
      Description:

      Environmentally-friendly ECAs offer many advantages vis-a-vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch. This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic. The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.


      With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-à-vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch.This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic.The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.
      Imprint Name:VSP International Science Publishers
      Publisher Name:Brill
      Country of Publication:GB
      Publishing Date:2008-12-23

      Additional information

      Weight920 g
      Dimensions179 × 257 × 28 mm